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The Universal Laser ULTRA X6000 is designed to meet the most demanding requirements of today’s manufacturing, product development, and materials research. It offers the processing of a wide range of advanced polymer and composite materials by utilizing patented hybrid laser technology with multi-wavelength capabilities.
A patent pending feature that provides an augmented reality user interface by superimposing design files on images of the material placed on the material support surface and captured by multiple cameras built into the laser system.
A feature that allows the user to program gas type and flow rate on a process-by-process basis within a control file.
A built-in aluminum honeycomb work surface designed to keep materials stationary and in focus during laser processing. Reduces back reflection and enables exhaust of laser processing byproducts from underneath materials. Includes a full-field masking material dispenser.
A feature that maintains curves in a design file, i.e., circles, ellipses, b-splines, Beziers, and NURBS, and ensures curves are kept throughout the path planning process rather than using linear interpolation.
A patent pending feature that provides an augmented reality user interface by superimposing design files on images of the material placed on the material support surface and captured by multiple cameras built into the laser system.
Motorized material support structure (Z-axis) and high-resolution touch sensor.
A patented technology that enables users to install and reinstall any supported ULS CO2 laser source onto any ULS laser system without tools and optical alignment to optimize laser processing for the widest variety of materials.
A powerful and unique database that generates laser processing parameters for a wide variety of materials and laser system configurations. If the system configuration changes, the database automatically recalculates the parameter values.
A patented technology that enables a combination of laser wavelengths (up to three wavelengths) to be focused to the same focal point within the same focal plane and used either sequentially or simultaneously.
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Material Processing Envelope (X,Y,Z)
32 x 24 x 12 in. (813 x 610 x 305 mm)
Maximum Effective Raster Material Processing Speed
(in SuperSpeedTM configuration)
>200 in./sec (5080 mm/sec
Multiple Laser Support
Up to 2 lasersSources can be used individually or in combination
Laser Sources Available
10.6 μm CO2: 10, 30, 40, 50, 60, 75 and 150 watt laser sources9.3 μm CO2: 10, 30, 50 and 75 watt laser sources1.06 μm Fiber: 50 watt laser source
Laser Sources Combinations
Up to (2) CO2 laser sources or up to(1) CO2 laser sources (10-150 watts) and up to (1) permanentlymounted fiber laser sourceSupports Rapid ReconfigurationTM of CO2 lasers
Maximum Laser Power
150 watts CO2, 50 watts Fiber
Power Requirements
220V-240V/16A
System External Dimensions
Width:55.00 in. (1397 mm) without Control Panel59.31 in. (1506 mm) with Control Panel folded83.75 in. (2172 mm) with Control Panel extendedDepth:46.32 in. (1177 mm)Height:48.00 in. (1219 mm) to top of enclosure e-stop
Weight
400 lbs. (181 Kg)Weight is approximate and varies with laser source selections
Exhaust Requirements
Intelligent Air Filtration (UAC 4000) or External Exhaust Blower Capable of >700 CFM at 6 in.WG Static Pressure (1190 m3/hr. at 1.5 kPa)6 in. (152mm) Exhaust Port
Computer Requirements
Minimum: Intel I3 processor (or equivalent) with at least 8 GB of memory, Windows 10 operating system, and connection to laser system with USB cable.Computer is not required if configured with available 21” Touch Screen Control Panel
Laser Safety Classification
Class 1 for material processing lasersClass 2 overall due to red laser pointerCan convert to Class 4 with optional Class 4 module
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